MIP Series — Micro LED in Package Display Modules
Next-generation MIP technology bridging the gap between SMD cost-efficiency and COB performance | The smart choice for fine-pitch LED
Products in this Series
MIP LED Screen Display MIP Series
MIP LED screen displays utilize an advanced Micro Injection Process (MIP) technology in their design. This innovative technique involves injecting a specialized protective layer over LED modules, enhancing their durability, contrast, and visual performance.
Why Choose MIP Series?
MIP delivers the best of both worlds — Micro LED precision with SMD-level cost efficiency and brightness
Micro LED Precision at Accessible Cost
MIP pre-packages Micro LEDs with individual micro-lenses on BT resin substrate — achieving pixel pitches down to P0.7mm at 40–60% lower cost than equivalent COB panels.
Superior Brightness & Light Extraction
Individual micro-lens per pixel focuses light forward with 30% higher extraction efficiency than COB encapsulation. Achieve 1200 nits at lower power — brighter displays with cooler operation.
Individual Pixel Replaceability
Unlike COB's monolithic surface, MIP's individually packaged pixels can be replaced at the component level. Field repair is faster, cheaper, and requires less specialized equipment.
5000:1 Contrast with Black Substrate
BT resin substrate with integral black mask achieves 5000:1 contrast — double that of traditional SMD. Deep blacks without the premium cost of COB encapsulation.
Compatible with Standard SMD Manufacturing
MIP modules are assembled on standard SMT pick-and-place lines with conventional reflow soldering. No cleanroom encapsulation required — faster production, better scalability, consistent quality.
Excellent Thermal Performance
Individual package-level heat dissipation through BT substrate vias. Lower thermal resistance than monolithic COB — each pixel manages its own heat without affecting neighbors.
Next-Generation Module Engineering
MIP technology brings semiconductor packaging precision to LED displays
MIP LED Package
Micro LED die (<100μm) mounted on BT-resin substrate with individual silicone micro-lens. Wafer-level packaging ensures consistent optical performance across millions of pixels.
Black-Mask PCB Substrate
6-layer HDI PCB with integral black solder mask between pixels. Eliminates cross-pixel light bleed for 5000:1 native contrast without relying on encapsulation for optical isolation.
SMT-Compatible Assembly
Standard pick-and-place and reflow processes — the same lines that build smartphones and laptops. Higher throughput, better yield, and more consistent quality than manual or specialized COB processes.
Individual Pixel Calibration
Each MIP package is factory-characterized for brightness and chromaticity. Module-level calibration compensates for individual pixel variance — achieving <ΔE2 color uniformity across the display.
Where MIP Series Excels
The smart choice for projects that demand fine-pitch quality without the premium COB price tag
Corporate Lobbies & Conference Centers
MIP delivers 4K resolution at sensible room sizes with P0.9–P1.5 pitch. The cost advantage over COB enables larger display areas within the same budget — more impact per dollar.
Control Rooms & Monitoring Centers
5000:1 contrast and individual pixel replaceability make MIP a practical choice for 24/7 environments where field serviceability and total cost of ownership are paramount.
Higher Education & Lecture Halls
MIP enables fine-pitch LED at university-friendly budgets. 4K resolution for detailed diagrams, research data, and video content in large lecture theaters.
Retail Digital Signage Networks
Scalable SMT production means MIP modules are consistently available at volume — critical for multi-location retail rollouts where supply chain reliability matters as much as performance.
Houses of Worship & Cultural Centers
MIP balances premium image quality with budget responsibility. 1200-nit brightness maintains visibility under sanctuary lighting while individual pixel serviceability ensures decades of reliable operation.
Commercial Digital Signage
For commercial integrators, MIP offers a future-proof fine-pitch platform with standard SMT manufacturing — ensuring consistent supply, predictable pricing, and established service workflows.
Technical Specifications
Complete performance parameters for MIP Series LED modules
| Parameter | MIP P0.7 | MIP P0.9 | MIP P1.2 | MIP P1.5 |
|---|---|---|---|---|
| Module Size — 300×168.75mm (standard), custom sizes available | ||||
| Package — BT-resin substrate, individual silicone micro-lens, wafer-level packaging process | ||||
| Manufacturing — Standard SMT pick-and-place + reflow, no cleanroom required | ||||
| Repairability — Individual pixel-level replacement on standard hot-air rework stations | ||||
| Calibration — Per-pixel factory characterization + module-level calibration, ΔE<2 uniformity | ||||
| Operating Temp — -10°C to +45°C | ||||
| Lifespan — ≥100,000 hours (50% brightness) | ||||
| Warranty — 2-year standard (optional extension to 5 years) | ||||
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From indoor fine-pitch to outdoor high-brightness, we offer a complete range of LED display solutions tailored to your project requirements.
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